1. 2. 3. material content data sheet sales product name tle7250vle issued 28. september 2015 ma# ma001335652 package pg-tson-8-1 weight* 27.05 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.493 5.52 5.52 55184 55184 leadframe inorganic material phosphorus 7723-14-0 0.003 0.01 109 non noble metal zinc 7440-66-6 0.012 0.04 436 non noble metal iron 7439-89-6 0.236 0.87 8728 non noble metal copper 7440-50-8 9.586 35.44 36.36 354409 363682 wire non noble metal copper 7440-50-8 0.035 0.13 0.13 1305 1305 encapsulation organic material carbon black 1333-86-4 0.029 0.11 1082 plastics epoxy resin - 1.507 5.57 55704 inorganic material silicondioxide 60676-86-0 13.092 48.41 54.09 484034 540820 leadfinish non noble metal tin 7440-31-5 0.387 1.43 1.43 14307 14307 plating noble metal silver 7440-22-4 0.043 0.16 0.16 1607 1607 glue plastics epoxy resin - 0.156 0.58 5774 noble metal silver 7440-22-4 0.468 1.73 2.31 17321 23095 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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